High-Speed Cable Automation
This is a semi-automatic solder ball jetting system featuring a 6-axis, dual-gantry, dual-station design with independent vision positioning. It enables integrated jetting operations with high efficiency, supporting rapid transfer and precise positioning of workpieces and fixtures.
Industry Focus
Widely applied in high-speed cable and connector manufacturing, 3C electronic connectors, precision cable assemblies, and other related fields requiring micro-solder ball jetting.
Applicable Products
Tailor-made for solder ball jetting of grounding plates, compression covers, and high-density connector terminals.
Line Compatibility
Supports semi-automatic operation with manual loading/unloading, and can be used as a standalone workstation.
Optional Configuration
1. P.S.A. Nitrogen Generator
2. Laser Power Upgrade
Configurable 100W / 200W / 300W laser source to match different solder ball sizes:
| Item | Specification |
|---|---|
| Dimensions (L×W×H) | 1,106 mm*1,200 mm*1,760 mm (including tabletop) |
| Vision Positioning Accuracy | ±0.005 mm |
| Positioning Accuracy (XYZ) | ±0.03 mm |
| Jetting Area | 200 × 200 mm |
| Laser Power Options | 100W / 200W / 300W single-mode continuous fiber laser |
| Solder Ball Diameter | 0.3 – 0.76 mm (configurable) |
| Nozzle Lifespan | > 600,000 cycles (imported from Israel) |
| Power Supply | AC 220V, 50/60Hz, 3000VA |
| Safety Protection | Dual safety light curtains (Dual-station independent operation) |
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